TSMC FinFlex, N2 Process Innovations Debut at 2022 North America Technology Symposium

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Benzinga
By Business Wire

TSMC ((TWSE: 2330,TSM today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company's 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex technology for the N3 and N3E processes making their debut.

Resuming as an in-person event after being held online in the past two years, the North America symposium in Santa Clara, California, kicks off a series of Technology Symposiums around the world in the coming months. The Symposiums also feature an Innovation Zone that spotlights the achievements of TSMC's emerging start-up customers.

We are living in a rapidly changing, supercharged, digital world where demand for computational power and energy efficiency is growing faster than ever before, creating unprecedented opportunities and challenges for the semiconductor industry, said Dr. C.C. Wei, CEO of TSMC. The innovations we will showcase at our Technology Symposiums demonstrate TSMC's technology leadership and our commitment to support our customers through this exciting period of transformation and growth.

Major technologies highlighted at the Symposium include:

TSMC FinFlex for N3 and N3E - TSMC's industry-leading N3 technology, set to enter volume production later in 2022, will feature the revolutionary TSMC FinFlex architectural innovation offering unparalleled flexibility for designers. The TSMC FinFlex innovation offers choices of different standard cells with a 3-2 fin configuration for ultra performance, a 2-1 fin configuration for best power efficiency and transistor density, and a 2-2 fin configuration providing a balance between the two for Efficient Performance. With TSMC FinFlex architecture, customers can create system-on-chip designs precisely tuned for their needs with functional blocks implementing the best optimized fin configuration for the desired performance, power and area target, and integrated on the same chip. For more information on FinFlex, please visit N3.TSMC.COM.

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