China's Memory Upstart YMTC Edges Closer to Rivals With 232-Layer Chip
By Josh Horwitz
SHANGHAI (Reuters) - Chinese chipmaker Yangtze Memory Technologies Co Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies.
The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday.
That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.
South Korea's SK Hynix has also developed its first 238-layer memory chip, boasting a new industry benchmark.
A YMTC spokesperson declined to comment on the Global Times report.
Industry experts say that while YMTC will unlikely launch mass production of the chip any time soon, it nevertheless marks a breakthrough for the company.
The company's market share remains in the single digits, but it is aggressively expanding production capacity and R&D with the help of state subsidies.
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